Panduit® GB2B0312TPI-1 Telecom Ground Busbar, 20 in L x 2 in W x 1/4 in H, 600 VAC
Grounding
246045
MFG #: GB2B0312TPI-1
Panduit®
205.83000
/ ea
- Application: Telecom/Data Center
- ARRA Compliant: Y
- Buy American Compliant: Y
- Catalog Number: GB2B0312TPI-1
- Clamp Material: Copper
- Construction: Flat
- Country of Origin: USA
- Currency: USD
- EU RoHS Indicator: Y
- Gross Volume Per Pack: 1.00
- Gross Volume per Pack Metric: 0.03
- Gross Volume UOM: CF
- Gross Volume UOM Metric: m3
- Gross Weight Per Pack: 5.8500 lb
- Gross Weight per Pack Metric: 1.49
- Gross Weight UOM Metric: kg
- Height: 5.10 in
- Height [Metric]: 12.9540 cm
- Length: 24.95 in
- Length [Metric]: 63.3730 cm
- Material: Copper
- Returnable: Y
- Size: 20 in
- Standard: BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment
- Standards: RoHS Compliant, BICSI, J-STD-607-A Requirements
- Sub Brand: StructuredGround?„?
- Type: Grounding Busbar
- UNSPSC: 46182103
- UPC 11: 07498365929
- UPC 12: 07498365929
- Width: 8.60 in
- Width [Metric]: 21.8440 cm
- Stock Status: NONSTOCK
- Brand: Panduit®
- Manufacturer: Panduit®
- Full Eng Drawing URL - C-RKGB4B0612TPI-1--ENG.dxf(Full Eng Drawing URL)
- http://www.panduit.com(Seller Home Page URL)
- Install Instructions 1 URL - GB2B0312TPI-1GrndBusbar.pdf(Install Instructions 1 URL)
- Spec Sheet 1 URL - Panduit_LTYK_Specification_Sheet.pdf(Spec Sheet 1 URL)
- Spec Sheet URL - 10965_F3S92Z1YKQUANPV4.pdf(Spec Sheet URL)
- Spec Sheet URL - SA-GRSP10 (TEBC) WEB 7-1-11.pdf(Spec Sheet URL)
- Tech Drawing 1 URL - Panduit_GB2B0312TPI_1_Technical_Drawing.pdf(Tech Drawing 1 URL)
- Tech Drawing URL - 10965_3A1Z2YCX0MI578WH.pdf(Tech Drawing URL)
- Video - http://www.panduit.com/heiler/Videos/M-GRStepsImplementingGRBSystem--169-ENG.mp4(Video)
- Video - https://www.panduit.com/content/dam/panduit/en/products/media/1/71/071/3071/110133071.mp4(Video)
- Applications
- Features
| Telecom/Data Center |
| Comes pre-assembled with brackets and insulators attached for quick installation |
| Insulators provide 600V of insulation |
| Made of high conductivity copper and tin-plated to inhibit corrosion |
| Use Panduit self-laminating laser/ink jet labels to identify busbars to meet TIA/EIA-606-A |
| 1/4 in stud hole, 5/8 in hole spacing |
| 3/8 in stud hole, 1 in hole spacing |
| (12) 1/4 in, (3) 3/8 in mounting holes |